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Document type:
Konferenzbeitrag / Conference Paper
Title:
Aging of epoxy moulding compound
Subtitle:
Thermomechanical properties during high temperature storage
Title of conference publication:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Subtitle of conference publication:
18-20 April 2016
Conference title:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (17., 2016, Montpellier)
Conference title:
EuroSimE 2016
Venue:
Montpellier, Frankreich
Year of conference:
2016
Date of conference beginning:
18.04.2016
Date of conference ending:
20.04.2016
Publisher:
IEEE Xplore® Digital Library
Year:
2016
Pages from - to:
1-6
Language:
Englisch
ISBN:
978-1-5090-2106-2 ; 978-1-5090-2120-8
Department:
Fakultät für Luft- und Raumfahrttechnik
Institute:
LRT 4 - Institut für Mechanik
Chair:
Lion, Alexander
Open Access yes or no?:
Nein / No
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