@article{,
    author = {Ammer, Michael; Cao, Yiqun; Rupp, Andreas; Sauter, Martin; Maurer, Linus},
    title = {Bringing the SEED Approach to the Next Level : Generating IC Models for System ESD and Electrical Stress Simulation out of Design Data},
    editor = {},
    booktitle = {},
    series = {},
    journal = {IEEE Transactions on Electromagnetic Compatibility},
    address = {},
    publisher = {IEEE},
    edition = {},
    year = {2020},
    isbn = {},
    volume = {62},
    number =  {1},
    pages = {25-35},
    url = {https://doi.org/10.1109/TEMC.2018.2888691},
    doi = {10.1109/TEMC.2018.2888691},
    keywords = {},
    abstract = {},
    note = {},
    institution = {Universität der Bundeswehr München, Fakultät für Elektrotechnik und Informationstechnik;Fakultät für Elektrotechnik und Technische Informatik, EIT 4 - Institut für Mikroelektronik und Schaltungstechnik;ETTI 1 - Institut für Physik, Elektrotechnik und Automatisierungstechnik, Professur: Sauter, Martin; Maurer, Linus},
    
    
}